ISL58344
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
2
FN7524.3
January 25, 2013
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ISL58344CIZ-T7A 功能描述:IC SENSOR RoHS:是 类别:传感器,转换器 >> 专用 系列:* 标准包装:40 系列:*
ISL58411IIZ-EVALZ 制造商:Intersil Corporation 功能描述:ISL58411IIZ-EVALZ (PB-FREE ) EVALUATION BOARD - ROHS COMPLIA - Bulk
ISL58511IIZ-EVALZ 制造商:Intersil Corporation 功能描述:ISL58511IIZ-EVALZ (PB-FREE ) EVALUATION BOARD - ROHS COMPLIA - Bulk
ISL5857 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-bit, +3.3V, 260+MSPS, High Speed D/A Converter
ISL5857EVAL1 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-bit, +3.3V, 260+MSPS, High Speed D/A Converter
ISL5857IA 功能描述:IC DAC 12-BIT 260MSPS 28-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率(每秒):*
ISL5857IAZ 功能描述:IC DAC 12-BIT 260MSPS 28-TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 设置时间:1µs 位数:8 数据接口:串行 转换器数目:8 电压电源:双 ± 功率耗散(最大):941mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC(0.295",7.50mm 宽) 供应商设备封装:24-SOIC W 包装:带卷 (TR) 输出数目和类型:8 电压,单极 采样率(每秒):*
ISL5857IB 功能描述:IC DAC 12BIT HIGH SPEED 28-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率(每秒):*